收藏词条 编辑词条 无电镀
创建时间:2010-03-25
无电镀(Electroless Plating)
无电镀又称之为化学镀(chemical plating)或自身催化电镀(autocatalyticplating)。无电镀是指于水溶液中之金属离子被在控制之环境下,予以化学还元,而不需电力镀在基材(substrate)上。ASTM B374之标准定义为 Autocatalytic
plating -〝deposition of a metallic coating by a controlled chemical reduction that is catalyzed by the metal or alloy being deposited〞。其过程(process)不同于浸镀(immersion plating),它的金属镀层是连续的(continu-ous)、自身具有催化性的(autocatalytic)。
无电镀又称之为化学镀(chemical plating)或自身催化电镀(autocatalyticplating)。无电镀是指于水溶液中之金属离子被在控制之环境下,予以化学还元,而不需电力镀在基材(substrate)上。ASTM B374之标准定义为 Autocatalytic
plating -〝deposition of a metallic coating by a controlled chemical reduction that is catalyzed by the metal or alloy being deposited〞。其过程(process)不同于浸镀(immersion plating),它的金属镀层是连续的(continu-ous)、自身具有催化性的(autocatalytic)。